the emergence of faster data rates, and decreasing signal rise times, requires better performing, high speed connectors. te connectivitys broad portfolio of high speed backplane connectors provides system designers the fexibility they require to solve their specifc performance challenges. indu str y applications ? servers- blade, rack mount and mainframe stackable, carrier grade, core, edge and metro ethernet ? switches- stackable, carrier grade, core, edge and metro ethernet ? routers- edge, core, enterprise class, carrier ethernet, bras and multi service edge ? optical- transport: carrier grade optical, metro wdm, optical multi-service provisioning, long haul optical and enterprise lan optical ethernet quick reference guide high speed backplane interconnect solutions www. te.com /products/2piece-high-speed
www. te.com/products/2piece-high-speed high speed backplane connectors te connectivity high spehdbgaidcp dpkl p te connectivity gets the best performance out of connectors by applying system-level signal integrity design expertise to each high-speed product. our modeling and simulation skills are second to none with global expertise in the u.s., europe, and asia. our global presence places simulation, modeling, and system layout experts next to the customer. pi-ro.etmce-mw.hgocp.iem at te the design process starts with signal integrity. signal integrity engineers use sophisticated 3d tools to provide accurate connector and footprint via pattern performance prior to production. te has the tools and expertise to get the right answer. n ansys hfss and cst microwave studio full-wave 3d tools n both connector and footprint via pattern(s) analyzed before production n s-parameter and spice analysis n sophisticated ads and matlab system analysis hgspihrdmwgttidpmce-msiiosm from test boards to simulation models, te provides a library of tools that help you successfully implement your system. requests can be easily made through our signal integrity website: www.te.com/documentation/electrical-models n ansys hfss and cst microwave studio full-wave 3d tools n both connector and footprint via pattern(s) analyzed before production n s-parameter and spice analysis n sophisticated ads and matlab system analysis n measurement based s-parameter connector models (64+ ports) n modeling based s-parameter connector models (64+ ports) n footprint via pattern s-parameter and spice models n spice connector models n connector evaluation test boards n system test boards srspmhctce.o.pu m with measurement capabilities beyond 12.5 gbps and 50 ghz, te can characterize and provide detailed measurements for its products. cutting-edge measurement calibration techniques and board design enable accurate de-embedding of test fxtures. te has also teamed with numerous silicon com - panies to provide active device measurements that can be invaluable to assure the successful implementation of a design. n advanced calibration techniques de-embed fxture n frequency domain to 50 ghz n time domain eye pattern/bert to 12.5 gbps n active silicon testing C multiple vendors 2 C 10+ gbps n both system and connector only boards
www. te.com/products/2piece-high-speed high speed backplane connectors te connectivity hkpitebapschhbdcat n up to 40gb/s performance n density up to 20 differential pairs per cm (52 dp per in) n available in 4, 6, and 8 pairs/column, supporting cardpitch of 16.4 mm (.64"), 20.4 mm (.8"), and 25.4 mm (1") respectively n see back panel for representative part numbers n website: www.te.com/products/stradawhisper imp ac t c onnec to r z- pa ck t inman100 ohm and 85 ohm c onnec to r z- pa ck slim uhd c ommon speed c onnec to r z- pa ck slim uhd high speed c onnec to r z- pa ck hm-z d c onnec to r z- pa ck hm-z d plus c onnec to r mul tigig rt c onnec to r z- pa ck hs3 c onnec to r 3-6 gb/s 6-10 gb/s 10-15 gb/s 15-20 gb/s 20-25 gb/s da ta ra te 25+ gb/s 80 dp/in 32 dp/cm 80 dp/in 32 dp/cm 36 dp/in 14 dp/cm 36 dp/in 14 dp/cm 40 dp/in 16 dp/cm 40 dp/in 16 dp/cm 57 dp/in 23 dp/cm 50 dp/in 24 dp/cm strad a whisper c onnec to r 52 dp/in 20 dp/cm
www. te.com/products/2piece-high-speed high speed backplane connectors te connectivity s p nop hoptopsrtpschhbdcat n up to 12.5 gb/s performance n density up to 16 differential pairs per cm (40 dp per inch), in 25.4 mm (1") slot-pitch n available in 2, 3 and 4 pairs/column, ftting 20.32 mm (0.8") slot-pitch for 2 and 3 pair version and 25.4 mm (1") slot-pitch for the 4 pair version n hm-zd plus provides enhanced signal integrity in a design backwards compatible with standard hm-zd n advanced differential fabric (adf) connector specifed in the picmg 3.x advanced tca specifcations n see back panel for representative part numbers n order catalog 1773095, "high speed backplane connector" n website: http://hmzd.te.com lzuyhr m lwqmhieerbpids n up to 6.25 gb/s performance n density up to 40 high speed signal lines (20 dp) per cm board space, in 25.4 mm (1") slot-pitch n available in 2 versions: six row and ten row, respectively ftting 20.32 mm (0.8") and 25.40 mm (1") slot-pitches n high-speed connector designed for both single ended and differential signals n see back panel for representative part numbers n order catalog 1773095, "high speed backplane connector" n website: http://hs3.te.com pa ds/b/bm nsmhieerbpids n up to 6.25 gb/s performance n density available in 2 versions per tier: 0.8" and 1", respectively ftting 20.32 mm (0.8") and 25.4 mm (1") slot-pitches n backplane connector system specifed in vme standards: vxs (vita 41) & vpx (vita 46) n pinless backplane connector utilizes a pcb construction which allows the connector system to have extreme fexibility. 100 ohm differential, 50 ohm single ended, open pin feld, and power wafers can be mixed within one connector module. n see back panel for representative part numbers n order catalog 1773095, "high speed backplane connector" n website: http://www.multigigrt.com
www. te.com/products/2piece-high-speed high speed backplane connectors te connectivity p enskpschhbdcat n up to 25 gb/s performance n density up to 32 high speed differential pairs per cm (80 dp per inch) n 100 ohm n modular system: 2, 3, 4, 5, 6 pair/ column available. 6 through 20 columns offered in increments of 2 columns n see back panel for representative part numbers n order catalog 7-1773458-1, "impact backplane connector system" n website: www.te.com/products/impact lzuyhr m s.epcem:66mcfhmce-m4+mcfhmhieerbpids n up to 12.5 gb/s performance n density up to 14 high speed differential pairs per cm (80 dp per inch); 6-16 columns available n modular system: 3, 4, 5, and 6 pair/column, respectively ftting 16.25mm (.625"), 20.32 mm (0.8") and 25.4 mm (1") slot-pitch n 85 ohm impedance version for qpcle and intel qpi standards, and other 85 ohm system applications n see back panel for representative part numbers n order catalog 1773095, "high speed backplane connector" n website: http://www.te.com/zpacktinman lzuyhrmwo.hm a l,mhieerbpids n 2 versions n cs (common speed) 8 gb/s n hs (high speed) 12.5 gb/s, scalable to 20 gb/s n density (in a 2 dp/column assignment): 55 lines per cm, 141 lines per inch (in a se assignment) n low profle 12.5 mm wide n flexible pin assignments n see back panel for representative part numbers n order catalog 1773095, "high speed backplane connector" n website: http://www.te.com/products/zpackuhd
for more information te technical support center usa: +1 (800) 522-6752 canada: +1 (905) 475-6222 mexico +52 (0) 55-1106-0800 latin/s. america: +54 (0) 11-4733-2200 germany: +49 (0) 6251-133-1999 uk: +44 (0) 800-267666 france: +33 (0) 1-3420-8686 netherlands: +31 (0) 73-6246-999 china: +86 (0) 400-820-6015 part numbers in this brochure are rohs compliant*, unless marked otherwise. *as defned www.te.com/leadfree te.com ? 2011 tyco electronics corporation, a te connectivity ltd. company. all rights reserved. 1654263-1 cis lug fp 3m 08/2011 multigig rt, te connectivity, the te connectivity (logo), z-pack and z-pack tinman are trademarks. other logos, product and/or company names might be trademarks of their respective owners. advanced tca is a trademark of picmg-pci industrial computer mfgs group. ansys hfss is a trademark of ansoft corporation. cst microwave studio is a trademark of cst computer simulation technology ag. impact is a trademark of molex inc. matlab is a trademark of the mathworks, inc. vita is a trademark of vmebus international trade association. while te has made every reasonable effort to ensure the accuracy of the information in this brochure, te does not guarantee that it is error-free, nor does te make any other representation, warranty or guarantee that the information is accurate, correct, reliable or current. te reserves the right to make any adjustments to the information contained herein at any time without notice. te expressly disclaims all implied warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantability or ftness for a particular purpose. the dimensions in this catalog are for reference purposes only and are subject to change without notice. specifcations are subject to change without notice. consult te for the latest dimensions and design specifcations. high speed backplane interconnects once you have determined which connector description best suits your needs, use the chart below to fnd a part number to search the te website. representative part numbers connector description plug receptacle strada whisper connectors 2149967-3 2149968-3 z-pack hm-zd connectors and z-pack hm-zd plus connectors 6469002-1 6469001-1 z-pack hs3 connectors 5120658-1 5120790-1 multigig rt connectors 1410187-3 1410142-1 impact connectors 2007777-1 2007703-1 z-pack tinman 100 ohm and 85 ohm connectors 1934269-1 1934218-1 z-pack slim uhd connectors 2042088-2 1982738-2
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